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Pumped Refrigerant Based Cooling for High Heat Density Applications
The Liebert XDO
overhead cooling module mounts directly above the
cold aisle, requiring no floorspace. This overhead
cooling unit draws
in hot air through two
opposite inlets and discharges cool air down into
the
cold aisle where the electronic equipment air inlets
are located.
The Liebert XDO is a part of our high heat-density
cooling product family that utilizes pumped
refrigerant
technology. The pumped refrigerant operates at low
pressure in the system and becomes a gas at room
conditions, making it ideal for use around
electronic
equipment. Since the Liebert XDO always provides
100% sensible capacity, the need for humidification
is significantly reduced, further reducing energy
usage and maintenance.
Smart Module technology:
Liebert XDO Smart Modules include integrated control
boards that provide the following capabilities:
-
Monitor fan status on the module with an
on-unit, red/green LED
- Be
alerted to the presence of condensation
-
Remotely shutdown the module via dry contact
closures
Liebert XDO system works well with the hot
aisle/cold aisle approach
The XDO system allows cooling-strapped data centers
to add capacities without new construction. For
Greenfield data centers, these systems can serve as
dedicated cooling or can complement the baseline
cooling and humidity control of traditional Liebert
CRAC/H units.
Is
the Liebert XDO the best high density solution for your
cooling needs?
Our engineers can help you select the best high density
solution for your cooling needs.
Click here
or Call 1-800-638-2638 for a free In-Row project
consultation. |
Liebert XDO
High Density Cooling System
The Liebert XDO offers many benefits:
Flexibility:
- Can cool more than
500 W/sq.ft. (5400 W/m2).
- Smart Module or Standard
configurations available.
- No floor space required.
- Complements Liebert
precision cooling units.
- Excellent for spot and
zone cooling.
- Scalable.
- Flexible installation with
several connection possibilities.
- Optional pre-charged flexible
piping with threaded quickconnect
fittings allows adaptive
and scalable expansion without
interruption of cooling operations.
- Possible to be fully installed
from an existing cold aisle
without the need for reaching
over existing racks.
- Compatible with Liebert XDP,
Liebert XDP with iCOM and
Liebert XDC systems.
Higher Availability:
- Uses pumped refrigerant,
which is ideal for use around
electronic equipment.
- Complete packaged unit includes
enclosure, coils, fan and piping.
Low Total Cost Of Ownership:
- Superior cost for cooling per high heat
density rack.
- Highly Energy Efficient
Ideally Suited For:
- Supplemental sensible cooling for high heat
density racks or zones
- Production Facilities
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